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HARVARD Citation
Li, Z. et al. (2018). The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles. Scripta materialia. pp. 1-5. [Online].
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Li, Z. et al. (2018). The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles. Scripta materialia. pp. 1-5. [Online].