Slip Flow in Elliptic Microducts with Constant Heat Flux. (9th October 2012)

• Record Type: Journal Article
• Authors: Spiga, Marco; Vocale, Pamela
• Other Names: Nguyen C. T. Academic Editor.
• Is Part Of: Advances in mechanical engineering. Volume 2012(2012)
• Publication Date: 2012-10-09
• Subjects: Mechanical engineering -- Periodicals; 621.05
• DOI: 10.1155/2012/481280
• Languages: English
• ISSNs: 1687-8132

Abstract

Abstract : This paper outlines a numerical model for determining the dynamic and thermal performances of a rarefied fluid flowing in a microduct with elliptical cross-section. A slip flow is considered, in laminar steady state condition, in fully developed forced convection, with Knudsen number in the range 0.001−0.1, in H1 boundary conditions. The velocity and temperature distributions are determined in the elliptic cross-section, for different values of both aspect ratio γ and Knudsen number, resorting to the Comsol Multiphysics software, to solve the momentum and energy equations. The friction factors (or Poiseuille numbers) and the convective heat transfer coefficients (or Nusselt numbers) are calculated and presented in graphs and tables. The numerical solution is validated resorting to data available in literature for continuum flow in elliptic cross-sections (Kn = 0) and for slip flow in circular ducts (γ = 1 ). A further benchmark is carried out for the velocity profile for slip flow in elliptical cross-sections, thanks to a recent analytical solution obtained using elliptic cylinder coordinates and the separation of variables method. The Poiseuille and Nusselt numbers for elliptic cross-sections are discussed. The results may be used to predict pressure drop and heat transfer performance in metallic microducts with elliptic cross-section, produced by microfabrication for microelectromechanical systems (MEMS).