An anchoring array assembly method for enhancing the electrical conductivity of composites of polypropylene and hybrid fillers. (28th July 2021)

• Record Type: Journal Article
• Authors: Zhu, Jiashu; Wan, Chaoying; Xu, Hong; Liu, Ying; Zhuang, Jian; Sun, Jingyao; Gao, Xiaolong; McNally, Tony; Huang, Yao; Wu, Daming
• Is Part Of: Composites science and technology. Volume 211(2021)
• Publication Date: 2021-07-28
• Subjects: Composites -- Polymer processing -- Electrical conductivity -- Anchoring array assembly method; Composite materials -- Periodicals; Composite materials; Fibrous composites; Periodicals; 620.118
• DOI: 10.1016/j.compscitech.2021.108846
• Languages: English
• ISSNs: 0266-3538

Abstract

Abstract: Constructing an interconnected filler-filler network in a polymer matrix is essential for enhancing the electrical conductivity of polymer composites. This work describes an Anchoring Array Assembly method for distribution of copper particles (CP) and carbon fibers (CF) in a polypropylene (PP) matrix. Constrained by a predesigned array anchoring template, the CP distribution achieved a high packing density in the PP matrix during compression molding which is key for filling the gaps between CFs, as well as for forming an interconnected hybrid filler network. Using the fixed array anchoring design, the dispersion and flow behavior of the conductive fillers and the polymer matrix are critical. When the inclination angle between the groove of the anchor mold and the horizontal plane is greater than 11.5°, the migration of CP in the molten PP in the anchor mold during the hot embossing process is restricted. The most conductive composites were obtained when the CPs were densely arranged in a triangular format. The conductive filler network was determined by the preset dense triangular "island-bridge" structure of the customized microarray mold. The conductivity of the composites prepared by the anchoring array assembly method (CF content 18 vol.% and CP content 2 vol.%) reached 137.70 S/m, 52 times higher than that prepared by traditional hot embossing methods with the same filler loading. Graphical abstract: Image 1