Carbon nanotubes reinforced copper composite with uniform CNT distribution and high yield of fabrication. (1st October 2017)

• Record Type: Journal Article
• Authors: Zheng, Liangfu; Sun, Jianren; Chen, Quanfang
• Is Part Of: Micro & nano letters. Volume 12:Number 10(2017)
• Page Start: 722
• Page End: 725
• Publication Date: 2017-10-01
• Subjects: carbon nanotubes -- nanocomposites -- nanofabrication -- particle reinforced composites -- copper -- nanoparticles -- electrodeposition -- powder metallurgy -- microhardness -- compaction -- sintering; carbon nanotube reinforced copper composites -- uniform CNT distribution -- CNT dispersion -- metal matrix composites -- bulk Cu‐CNT composites -- copper encapsulated CNT powders -- electrochemical deposition -- copper electrolyte -- sonication -- powder metallurgy process -- microhardness -- sintering -- compaction -- electrochemical codeposition -- Cu‐C; Nanotechnology -- Periodicals; Nanostructures -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1049/mnl.2017.0317
• Languages: English
• ISSNs: 1750-0443

Abstract

Abstract : Dispersion of carbon nanotubes (CNTs) in metal matrix composites has been an unsolved issue since the discovery of CNTs. This paper presents a newly developed fabrication process of bulk Cu/CNT composite with uniformly distributed CNTs. That is, copper encapsulated CNTs powders were firstly fabricated by an electrochemical deposition where CNTs can be completely dispersed in the copper electrolyte assisted by sonication, and then the fabricated composite powders were used to make bulk Cu/CNT composite by a powder metallurgy process. The increment in microhardness of Cu/CNT composite after compaction and sintering was observed to be ∼47.6% per 1% CNTs. The developed fabrication process of Cu/CNT composite powders by electrochemical co‐deposition can be scaled up to meet specific application needs, and a similar process is expected to be applicable for other metals.