Cu@Ag core–shell nanoparticle with multiple morphologies: a simple surfactant‐free synthesis and finite element simulation. (27th May 2020)

• Record Type: Journal Article
• Authors: Liang, Mengfan; Zhu, Yan; Sun, Shuhong
• Is Part Of: Micro & nano letters. Volume 15:Number 6(2020)
• Page Start: 396
• Page End: 398
• Publication Date: 2020-05-27
• Subjects: nanofabrication -- silver -- scanning electron microscopy -- thermal stability -- thermal analysis -- finite element analysis -- nanoparticles -- copper -- core‐shell nanostructures -- surface morphology -- electrical conductivity -- light absorption; thermal stability -- thermo‐gravimetric analysis -- scanning electron microscopy -- surfactant‐free synthesis -- finite element simulation -- galvanic exchange method -- Cu‐Ag core‐shell nanoparticle -- morphology -- Cu‐Ag; Nanotechnology -- Periodicals; Nanostructures -- Periodicals; Microtechnology -- Periodicals; 620.5
• DOI: 10.1049/mnl.2019.0776
• Languages: English
• ISSNs: 1750-0443

Abstract

Abstract : Cu@Ag nanoparticles with multiple morphologies were prepared using the galvanic exchange method with surfactant‐free in air. The thermal stability of as‐prepared nanoparticles was evaluated by thermo‐gravimetric analysis and the morphology evolution of the sample as conductive ink was investigated by using a scanning electron microscope. In the meantime, the optical properties of synthesised nanoparticles were simulated by the finite‐element method. It is feasible for Cu@Ag nanoparticles to be applied as a conductive.