Cite
HARVARD Citation
Liu, S. et al. (2016). Admittance extraction and analysis for through silicon vias near edge and at corner of silicon substrate. IET microwaves, antennas & propagation. 10 (12), pp. 1345-1351. [Online].
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Liu, S. et al. (2016). Admittance extraction and analysis for through silicon vias near edge and at corner of silicon substrate. IET microwaves, antennas & propagation. 10 (12), pp. 1345-1351. [Online].