A New Dynamic‐Copula Based Correlated Degradation Feature for Remaining Useful Life Prediction. Issue 1 (1st January 2021)

• Record Type: Journal Article
• Authors: Juan, Li; Hongde, Dai; Bo, Jing; Xiaoxuan, Jiao
• Other Names: Liu Datong guestEditor.; Zhang Bin guestEditor.; (Peter) Liu Jie guestEditor.; Boland David guestEditor.
• Is Part Of: Chinese journal of electronics. Volume 30:Issue 1(2021)
• Page Start: 36
• Page End: 44
• Publication Date: 2021-01-01
• Subjects: Remaining useful life -- Dynamic copula -- Random effect Wiener‐process -- Solder joints; Electronics -- Periodicals; Electronics -- China -- Periodicals; Electronics; China; Periodicals; 621.38105
• DOI: 10.1049/cje.2020.11.004
• Languages: English
• ISSNs: 1022-4653

Abstract

Abstract : Feature extraction plays an important role in Remaining useful life (RUL) prediction. Feature extraction mainly depends on the performance degradation signal in the previous study, in which the dynamic correlations among different signals are ignored, and the RUL accuracy is affected. A new dynamic feature based on the correlations of the performance degradation signal is proposed. First, dynamic correlation coefficients are calculated by copula function as the multivariate correlation performance degradation features. Second, the random effect Wiener process is used for RUL prediction based on the new features, and the maximum likelihood estimation is adopted to calculate the unknown parameters of the Wiener process. Finally, the RUL estimation for solder joints under vibration load is carried out compared with the quantile and quantile‐Principal component analysis (PCA) mixed feature extraction method. The research results show that the proposed method improved the prediction accuracy of RUL.