Low‐loss compact power combiner for solid state power amplifiers with high reliability. Issue 3 (1st February 2016)

• Record Type: Journal Article
• Authors: Gholami, Mehrdad; Amaya, Rony E.; Yagoub, Mustapha C.E.
• Is Part Of: IET microwaves, antennas & propagation. Volume 10:Issue 3(2016)
• Page Start: 310
• Page End: 317
• Publication Date: 2016-02-01
• Subjects: power combiners -- power amplifiers -- milling machines; low‐loss compact power combiner -- solid state power amplifiers -- SSPA -- low insertion loss -- novel magic‐tee configuration -- microstrip‐to‐waveguide transition -- automatic milling machines; Microwaves -- Periodicals; Microwave antennas -- Periodicals; Antennas (Electronics) -- Periodicals; Radio wave propagation -- Periodicals; Microwave communication systems -- Periodicals; 621.381305
• DOI: 10.1049/iet-map.2015.0403
• Languages: English
• ISSNs: 1751-8725

Abstract

Abstract : In this study, a low‐loss and compact planar power combiner for solid state power amplifiers (SSPAs) is proposed. It combines eight power amplifier modules with low insertion loss (IL) and high reliability by utilising a novel magic‐Tee configuration and E ‐plane bend along with a suitable microstrip‐to‐waveguide transition. The fabricated prototype was implemented through automatic milling machines to produce three planar layers that form the final structure. This novel approach enabled precise fabrication, simple assembly of the SSPAs as well as low‐cost manufacturing in comparison with existing traditional approaches. This process is suitable for SSPAs operating from 4 to 40 GHz. The combined IL of the implemented combiner network is less than 0.6 dB at Ka‐band, 0.5 dB at Ku‐band, and 0.4 dB at X‐band while exhibiting a 10% fractional bandwidth.