3D printed bandpass filters using compact high‐Q hemispherical resonators with improved out‐of‐band rejection. Issue 6 (1st March 2017)

• Record Type: Journal Article
• Authors: Li, Jin; Guo, Cheng; Mao, Lijian; Xu, Jun
• Is Part Of: Electronics letters. Volume 53:Issue 6(2017)
• Page Start: 413
• Page End: 415
• Publication Date: 2017-03-01
• Subjects: band‐pass filters -- millimetre wave filters -- resonator filters -- Q‐factor -- ceramics -- resins -- integrated circuit metallisation -- copper alloys -- silver alloys -- stereolithography; 3D printed millimetre‐wave bandpass filters -- compact high‐Q hemispherical resonators -- improved out‐of‐band rejection -- RF design -- compact high‐quality‐factor -- hemispherical cavity resonators -- X band -- Ka‐band fourth‐order BPF -- high‐temperature‐resistant ceramic‐filled resin -- stereolithography‐based 3D printing -- surface metallisation -- electroless copper‐silver plating -- loss 0.43 dB to 0.9 dB -- frequency 31.52 GHz to 32.42 GHz -- Cu‐Ag; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2016.4373
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : RF design and implementation of ceramic‐filled resin‐based 3D printed millimetre‐wave bandpass filters (BPFs) using a new class of compact high‐quality‐factor hemispherical cavity resonators are addressed. Design concept of the hemispherical resonator is discussed for BPF applications in both X and Ka bands. For validation purpose, the Ka ‐band fourth‐order BPF is fabricated with a high‐temperature‐resistant ceramic‐filled resin using a fast and low‐cost stereolithography‐based 3D printing technique, and its surface metallisation is realised by employing electroless copper/silver plating. The proposed BPF's geometrical configuration contributes to a significantly improved out‐of‐band rejection. The RF‐measured results demonstrate the Ka ‐band BPF an insertion loss of 0.43−0.9 dB from 31.52 to 32.42 GHz, a passband return loss mostly better than 15 dB, and a small frequency shift of about 0.06%.