Compact multilayer self‐packaged filter with surface‐mounted packaging. Issue 7 (1st April 2015)

• Record Type: Journal Article
• Authors: Ma, K.; Fan, L.; Zhang, S.
• Is Part Of: Electronics letters. Volume 51:Issue 7(2015)
• Page Start: 564
• Page End: 566
• Publication Date: 2015-04-01
• Subjects: band‐pass filters -- surface mount technology -- printed circuits -- resonator filters; compact multilayer self‐packaged filter -- band pass filter -- surface‐mounted packaging -- multilayer print circuit board technology -- PCB -- multilayer structure -- lumped step‐impedance resonator -- compact size -- insertion loss -- connector loss -- bandwidth 120 MHz -- bandwidth 800 MHz; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2014.4129
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : A new self‐packaged bandpass filter by using multilayer print circuit board technology is proposed and investigated. By using a multilayer structure, a lumped step‐impedance resonator as well as self‐packaging, the designed filter can achieve a much more compact size, low insertion loss and a wide stopband. The implemented filter operated at a centre frequency of 800 MHz with a 3 dB bandwidth of 120 MHz demonstrates stopband rejection better than 25 dB up to 4 GHz. The measured insertion loss including the connector loss in the input and output is 1.48 dB. The size of the filter is only 12 × 8 mm, i.e. 0.059 λ g × 0.039 λ g .