Multi‐material additive manufacturing of embedded low‐profile antennas. Issue 20 (1st October 2015)

• Record Type: Journal Article
• Authors: Pa, P.; Larimore, Z.; Parsons, P.; Mirotznik, M.
• Is Part Of: Electronics letters. Volume 51:Issue 20(2015)
• Page Start: 1561
• Page End: 1562
• Publication Date: 2015-10-01
• Subjects: electrical products industry -- dipole antennas -- microstrip antennas; frequency 2.6 GHz -- AMC ground plane -- balun -- wavelength printed dipole -- three‐dimensional conducting networks -- robust antenna system -- conductive microdispensing printing -- integrated artificial magnetic conducting ground plane -- embedded low‐profile antennas -- multimaterial additive manufacturing; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2015.2186
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : A low‐profile antenna that includes an integrated artificial magnetic conducting (AMC) ground plane is presented and is fully fabricated using multi‐material additive manufacturing. It is shown that combining standard fused deposition modelling with conductive micro‐dispensing printing enable one to realise mechanically robust antenna systems that contain spatially variable dielectric properties and intricate three‐dimensional conducting networks. To illustrate this capability, a low‐profile antenna is designed, fabricated, and experimentally validated, consisting of a standard 2.6 GHz half wavelength printed dipole, balun, and AMC ground plane.