Additive manufacturing of 3D substrate integrated waveguide components. Issue 18 (1st September 2015)

• Record Type: Journal Article
• Authors: Moscato, S.; Bahr, R.; Le, T.; Pasian, M.; Bozzi, M.; Perregrini, L.; Tentzeris, M.M.
• Is Part Of: Electronics letters. Volume 51:Issue 18(2015)
• Page Start: 1426
• Page End: 1428
• Publication Date: 2015-09-01
• Subjects: three‐dimensional printing -- substrate integrated waveguides -- microstrip lines; 3D substrate integrated waveguide components -- 3D SIW components -- additive manufacturing technique -- 3D printing process -- t‐glase filament -- microwave components -- 3D printed material -- microstrip lines technique -- SIW cavity resonator -- E‐plane bends; Electronics -- Periodicals; 621.381
• DOI: 10.1049/el.2015.2298
• Languages: English
• ISSNs: 0013-5194

Abstract

Abstract : The implementation of fully three‐dimensional (3D) substrate integrated waveguide (SIW) components by using an additive manufacturing technique is demonstrated for the first time. In particular, a 3D printing process based on the t‐glase filament has been adopted. 3D printing allows for the manufacturing of very complex shapes in a few hours, thus leading to a one‐day prototyping time for microwave components. To characterise the electromagnetic properties of the 3D printed material, a microstrip lines technique has been adopted. To fully demonstrate the potential of the proposed fabrication process, a SIW cavity resonator and a 3D SIW interconnect with four E‐plane bends have been fabricated and tested.