Cite
HARVARD Citation
Ghaderi, D. (2021). Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element method. Microelectronics and reliability. p. . [Online].
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Ghaderi, D. (2021). Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element method. Microelectronics and reliability. p. . [Online].