Cite
HARVARD Citation
Zheng, Z. et al. (2021). Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application. Nanotechnology. p. . [Online].
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Zheng, Z. et al. (2021). Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application. Nanotechnology. p. . [Online].