A Fluorinated Thermocrosslinkable Organosiloxane: A New Low‐k Material at High Frequency with Low Water Uptake. Issue 5 (13th December 2020)

• Record Type: Journal Article
• Authors: Liu, Fengping; Chen, Xingrong; Hou, Jiaren; Sun, Jing; Fang, Qiang
• Other Names: Brook Michael A. guestEditor.; Skov Anne L. guestEditor.
• Is Part Of: Macromolecular rapid communications. Volume 42:Issue 5(2021)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-12-13
• Subjects: dielectric constant -- dielectric loss -- high frequency -- polysiloxane -- thermosets; Macromolecules -- Periodicals; Polymers -- Periodicals; Chemistry -- Periodicals; 547.705
• DOI: 10.1002/marc.202000600
• Languages: English
• ISSNs: 1022-1336

Abstract

Abstract: In order to obtain low ‐k material with good comprehensive properties, a trifluoromethyl‐containing organosiloxane with thermocrosslinkable vinyl and benzocyclobutene groups is designed and synthesized through the Piers–Rubinsztajn reaction. After treating at high temperature, the organosiloxane changed to form a cross‐linked polysiloxane (called as c‐FSi‐BCB). c‐FSi‐BCB exhibits good dielectric properties with dielectric constant ( D k ) of 2.60 and dielectric loss ( D f ) of 1.49 × 10 −3 at a high frequency of 5 GHz. Importantly, c‐FSi‐BCB maintains such good dielectric properties and exhibits low water uptake of below 0.076%, even after immersing it in boiling water for 96 h. c‐FSi‐BCB also displays good thermostability with a 5% weight loss temperature ( T 5d ) of 453 °C. These data indicate that this fluorinated organosiloxane is suitable as the matrix resin for the fabrication of devices used in 5G communication. Abstract : A trifluoromethyl‐containing polysiloxane exhibits good dielectric properties with a D k of 2.60 and a D f of 1.49 × 10 −3 at a high frequency of 5 GHz. It also displays low water uptake and maintains low D k and D f even when being immersed in boiling water for 96 h.