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HARVARD Citation
Lassnig, A. et al. (2021). Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.. Materials & design. p. . [Online].
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Lassnig, A. et al. (2021). Adhesion evaluation of thin films to dielectrics in multilayer stacks: A comparison of four-point bending and stressed overlayer technique.. Materials & design. p. . [Online].