Formation Mechanism and Microstructures of Sn Films on Mo/Cu Substrates by Electrodeposition. Issue 8 (28th May 2015)

• Record Type: Journal Article
• Authors: Ren, P.; Dai, N.; Deng, H. Y.; Zhang, J. X.
• Is Part Of: Journal of the Electrochemical Society. Volume 162:Issue 8(2015)
• Page Start: D376
• Page End: D381
• Publication Date: 2015-05-28
• Subjects: electrodeposition -- microstructure -- nucleation mechanism -- Sn films; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0871508jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : Tin (Sn) films have been prepared on a molybdenum substrate covered with copper (Mo/Cu) by the electrodeposition method from the electrolyte solutions of tin sulfate (SnSO4 ) and trisodium citrate (C6 H5 Na3 O7 ). The formation mechanism and microstructures of the films were investigated by cyclic voltammetry (CV), chronoamperometry (CA), scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS). The CV and CA measurements show the electrodeposition is controlled by the diffusion process of tin ions. By means of Scharifker-Hills model and microstructural analysis, the Sn nucleation mechanism is clarified to be an instantaneous nucleation mechanism. The influence of deposition time, solution concentration and the potential on microstructures of Sn films has been systematically investigated and the optimal growth parameters for preparing dense Sn films are obtained.