(Invited) Heterogeneous Photonic Integration by Direct Wafer Bonding. (24th August 2016)
- Record Type:
- Journal Article
- Title:
- (Invited) Heterogeneous Photonic Integration by Direct Wafer Bonding. (24th August 2016)
- Main Title:
- (Invited) Heterogeneous Photonic Integration by Direct Wafer Bonding
- Authors:
- Davenport, Michael L
Chang, Lin
Huang, Duanni
Volet, Nicolas
Bowers, John E - Abstract:
- Abstract : Direct wafer bonding is a powerful technique for combiningsemiconductor materials that cannot normally be monolithicallyintegrated. It allows combination of heterogeneous materials withdifferent properties onto a single substrate, enabling the productionlarge scale and multi-functional photonic circuits.
- Is Part Of:
- ECS transactions. Volume 75:Number 9(2016)
- Journal:
- ECS transactions
- Issue:
- Volume 75:Number 9(2016)
- Issue Display:
- Volume 75, Issue 9 (2016)
- Year:
- 2016
- Volume:
- 75
- Issue:
- 9
- Issue Sort Value:
- 2016-0075-0009-0000
- Page Start:
- 179
- Page End:
- 183
- Publication Date:
- 2016-08-24
- Subjects:
- Electrochemistry -- Periodicals
Electrochemistry
Periodicals
Electronic journals
Electronic journal
541.37 - Journal URLs:
- http://ecsdl.org/ECST/ ↗
http://rzblx1.uni-regensburg.de/ezeit/warpto.phtml?colors=7&jour_id=81944 ↗
https://iopscience.iop.org/journal/1938-5862 ↗
http://www.electrochem.org/ ↗ - DOI:
- 10.1149/07509.0179ecst ↗
- Languages:
- English
- ISSNs:
- 1938-5862
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 15689.xml