(Invited) Semiconductor Packaging Technology to Progress the IoT Era. (23rd August 2016)

• Record Type: Journal Article
• Authors: Takeno, Yasuhiko
• Is Part Of: ECS transactions. Volume 75:Number 7(2016)
• Page Start: 3
• Page End: 6
• Publication Date: 2016-08-23
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07507.0003ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : AI (Artificial Intelligence) and IoT that many things on the Internet to connect (Internet of Things) technology is going to bring about the economic boom changing the industry and human life. Semiconductor market, has expanded the market while repeating the ups and downs of the economy, Semiconductor market at that time is expected to increase 30 percent from 2015, of which about 70% is in the IOT. Package has been changed to suit the application equipment. And packaging technology required for the IoT era is a SiP of 2D, 2.5D, 3D. In the Edge side, is used package technology called FOWLP, AI chip package in the data center side, 3D stacked DRAM (HBM, HMC) and is connected to the GPU and CPU in 3D and 2.5D, further new high-density, high-speed packaging technology is required.