An improved measure of quality loss for notching processes. (28th July 2020)
- Record Type:
- Journal Article
- Title:
- An improved measure of quality loss for notching processes. (28th July 2020)
- Main Title:
- An improved measure of quality loss for notching processes
- Authors:
- Wu, Chia Huang
Hsu, Ya Chen
Pearn, Wen Lea - Abstract:
- Abstract: Nowadays, electronic products are progressively becoming thinner, lighter, and more convenient for people to use. Printed circuit boards, and especially integrated circuit (IC) substrates, are among the essential component of these products. The IC substrate not only protects circuits, fixes lines, and conducts heat, but is also the critical component that provides signal connectivity between the chip, the printed circuit boards, and other crucial parts during the packaging process. The process capability index C pm is commonly used to assess the product quality loss for decision making in modern semiconductor packaging manufacturing. For high‐definition products, packaging processes often have very strict quality requirements and thus the quality inspection procedure is time‐consuming and complicated. Therefore, because of the limitation of manpower and capacity of the inspection instruments, the collected sample for quality assessment may be with small to moderate sample sizes. In this paper, we introduce an unbiased estimator for C pm and provide a step‐by‐step parametric bootstrap procedure for obtaining a composite lower confidence bound on C pm . To compare with the approaches discussed in the literature, numerical simulations are conducted under various process parameter settings. The results show that for small to moderate sample sizes, the proposed method applying the unbiased estimator has more accurate coverage rates than the existing methods. At the endAbstract: Nowadays, electronic products are progressively becoming thinner, lighter, and more convenient for people to use. Printed circuit boards, and especially integrated circuit (IC) substrates, are among the essential component of these products. The IC substrate not only protects circuits, fixes lines, and conducts heat, but is also the critical component that provides signal connectivity between the chip, the printed circuit boards, and other crucial parts during the packaging process. The process capability index C pm is commonly used to assess the product quality loss for decision making in modern semiconductor packaging manufacturing. For high‐definition products, packaging processes often have very strict quality requirements and thus the quality inspection procedure is time‐consuming and complicated. Therefore, because of the limitation of manpower and capacity of the inspection instruments, the collected sample for quality assessment may be with small to moderate sample sizes. In this paper, we introduce an unbiased estimator for C pm and provide a step‐by‐step parametric bootstrap procedure for obtaining a composite lower confidence bound on C pm . To compare with the approaches discussed in the literature, numerical simulations are conducted under various process parameter settings. The results show that for small to moderate sample sizes, the proposed method applying the unbiased estimator has more accurate coverage rates than the existing methods. At the end of this paper, an application of quality loss assessment in notching processes is demonstrated. … (more)
- Is Part Of:
- Quality and reliability engineering international. Volume 37:Number 1(2021)
- Journal:
- Quality and reliability engineering international
- Issue:
- Volume 37:Number 1(2021)
- Issue Display:
- Volume 37, Issue 1 (2021)
- Year:
- 2021
- Volume:
- 37
- Issue:
- 1
- Issue Sort Value:
- 2021-0037-0001-0000
- Page Start:
- 108
- Page End:
- 122
- Publication Date:
- 2020-07-28
- Subjects:
- lower confidence bound -- notching processes -- parametric bootstrap method -- quality loss -- unbiased estimator
Reliability (Engineering) -- Periodicals
Quality control -- Periodicals
High technology -- Periodicals
620.00452 - Journal URLs:
- http://www3.interscience.wiley.com/cgi-bin/jhome/3680 ↗
http://onlinelibrary.wiley.com/ ↗ - DOI:
- 10.1002/qre.2724 ↗
- Languages:
- English
- ISSNs:
- 0748-8017
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - 7168.137300
British Library DSC - BLDSS-3PM
British Library STI - ELD Digital store - Ingest File:
- 15698.xml