(Invited) Integration of 2D Materials for Advanced Devices: Challenges and Opportunities. (1st May 2017)

• Record Type: Journal Article
• Authors: Addou, Rafik; Wallace, Robert M
• Is Part Of: ECS transactions. Volume 79:Number 1(2017)
• Page Start: 11
• Page End: 20
• Publication Date: 2017-05-01
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07901.0011ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : Two-dimensional (2D) materials have captured the imagination and significant effort in the research of advanced device concepts. In spite of interesting device physics and proof-of-concept demonstrations, the integration of such materials with "mainstream" Si technology remains a challenge with very significant opportunities if met. This paper looks at these challenges from the prospective of materials surface and interface research, and identifies opportunities to enable 2D materials to augment.