Height Uniformity of Micro-Bumps Electroplated on Thin Cu Seed Layers. (4th May 2016)

• Record Type: Journal Article
• Authors: Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe M; Radisic, Aleksandar
• Is Part Of: ECS transactions. Volume 72:Number 4(2016)
• Page Start: 145
• Page End: 152
• Publication Date: 2016-05-04
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07204.0145ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : In this study a quick and cost-effective approach is developed to evaluate the micro-bump height uniformity on wafer level. Our numerical simulation of bump-height distribution uses experimentally measured i - η curve, and requires no explicit knowledge of the plating bath components. Theoretical predictions are well matched with results obtained for Cu micro-bumps plated on 300 mm wafers with Cu seeds of varying thickness. The method can be easily adapted to address the challenges of fabrication of multi-layered features and different cell and electrode geometries.