(Invited) The New Silicon Industry: Silicon CMOS ASICs Incorporating Compound Semiconductors. (20th July 2018)

• Record Type: Journal Article
• Authors: Fitzgerald, Eugene A.
• Is Part Of: ECS transactions. Volume 86:Number 7(2018)
• Page Start: 109
• Page End: 112
• Publication Date: 2018-07-20
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/08607.0109ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : We describe the integration of new semiconductor materials into a silicon CMOS process utilizing the existing silicon CMOS supply chain. Epitaxy, wafer bonding, device modeling and design incorporate new innovative elements, allowing for a scalable commercial model. First applications will occur in application-specific integrated circuits (ASICs), as was the case with conventional silicon integration at the start of the industry.