Dewetting Model Study on a Spinning Substrate - Challenges for Low Chemical Consumption. (11th September 2015)

• Record Type: Journal Article
• Authors: Sano, Ken-ichi; Mui, David; Kawaguchi, Mark
• Is Part Of: ECS transactions. Volume 69:Number 8(2015)
• Page Start: 139
• Page End: 144
• Publication Date: 2015-09-11
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/06908.0139ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : A model is proposed to describe the wetting and dewetting dynamics on a spinning wafer with a non-wetting surface. The model is based on the dynamic balance between the wetting and dewetting velocities. The proposed model predicts a theoretical lower limit for the media flow rate to completely wet a wafer surface as a function of the contact angle and wafer rotational speed. The model predictions are found to agree reasonably well with experimental results. The model is also used to develop a low flow process for the removal of titanium nitride. A 66% flow rate reduction is achieved in comparison with the baseline process.