Optimizing TSV Fill Phases for Improved Fill Rate, Process Stability and Void Performance. (10th September 2015)

• Record Type: Journal Article
• Authors: Ghekiere, John; Mikkola, Robert; Kebreab, Daniel; Burnham, James; Hoerner, Bridger; Erickson, David
• Is Part Of: ECS transactions. Volume 69:Number 6(2015)
• Page Start: 41
• Page End: 53
• Publication Date: 2015-09-10
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/06906.0041ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : This paper will explore the differences between the theoretical optimal electrochemical polarization conditions within the via during the key phases of gap filling (e.g. nucleation, conformal filling, and the transition to bottom-up filling), and compare to the actual conditions of conventional processing. The gaps between the optimal and actual conditions identify opportunities for innovation to significantly reduce fill time, provide supreme stability of the bath and minimize overburden thickness. The paper describes several such innovations.