Ruthenium Electrodeposition from Deep Eutectic Solvents. Issue 13 (26th September 2018)

• Record Type: Journal Article
• Authors: Bernasconi, R.; Lucotti, A.; Nobili, L.; Magagnin, L.
• Is Part Of: Journal of the Electrochemical Society. Volume 165:Issue 13(2018)
• Page Start: D620
• Page End: D627
• Publication Date: 2018-09-26
• Subjects: Deep Eutectic solvent -- Electrodeposition -- Ruthenium; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0541813jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : Ruthenium is electrodeposited for the first time from a deep eutectic solvent based electrolyte composed of ethylene glycol and choline chloride in 1:2 molar ratio. Deposition is found to effectively occur upon addition of sulfamic acid to the Ru(III) containing deep eutectic solvent. The main consequence of the presence of sulfamic acid, as evidenced by the electrochemical characterization performed, is the oxidation of Ru(III) to Ru(IV). Consequently, Ru electroreduction is demonstrated to take place from the tetravalent state. Optimized plating conditions are able to yield uniform and crack-free Ru coatings up to 800 nm thickness. No oxides or other notable secondary phases can be individuated in the obtained metallic layers. Morphological and electrical properties of the layers obtained are comparable with Ru coatings deposited from sputtering and suggest possible applications in the electronics field as barrier layers for interdiffusion.