Electrodeposition of AgCuO2 Nanoplates. Issue 4 (25th January 2017)

• Record Type: Journal Article
• Authors: Lu, Qinyan; Lu, Kedan; Zhang, Lijie; Gong, Jianying; Liu, Run
• Is Part Of: Journal of the Electrochemical Society. Volume 164:Issue 4(2017)
• Page Start: D130
• Page End: D134
• Publication Date: 2017-01-25
• Subjects: AgCuO2 -- discharge process -- electrodeposition -- nanoplates -- silver copper oxides; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0261704jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : AgCuO2 nanoplates have been electrodeposited onto indium-tin oxide (ITO) coated glass near room temperature in an alkaline aqueous solution contained silver(I)/copper(II) ammonia complexes . The Ag(I)/Cu(II) ammonia complexes act as water or ammonia oxidation catalysts to generate acid and lower the local pH at ITO electrode, and then Ag + and Cu 2+ ions are partial oxidized and dissociated from complexes to react with OH − to form AgCuO2 deposits on ITO. The electrodeposited AgCuO2 are composed of single crystal cuboidal nanoplates with a preferential orientation along [−202] crystal axis. X-ray photoelectron spectra results indicate that the Ag and Cu ions in AgCuO2 are partially oxidized to +3 valence states. The as-electrodeposited AgCuO2 nanoplates show four distinct discharge processes at +0.28, +0.01, −0.42, and −0.67 V vs. Ag/AgCl.