Communication—Triphenylmethane-Based Leveler for Microvia Filling in Copper Super-Conformal Electroplating. Issue 13 (19th August 2019)

• Record Type: Journal Article
• Authors: Luo, Jiye; Li, Zhen; Tan, Baizhao; Cui, Chengqiang; Shi, Minghao; Hao, Zhifeng
• Is Part Of: Journal of the Electrochemical Society. Volume 166:Issue 13(2019)
• Page Start: D603
• Page End: D605
• Publication Date: 2019-08-19
• Subjects: Electrodeposition -- Electrodeposition - Copper -- Electrodeposition - semiconductors -- Leveler -- Microvia filling -- Super-conformal Electroplating; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0531913jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : Levelers exhibiting high microvia-filling power and wide operating-concentration ranges are required for the development of additives in copper super-conformal electroplating. In this study, a novel structure based on triphenylmethane (TPM-1) was synthesized and investigated as a leveler for microvia-filling electroplating. The galvanostatic measurements and cyclic voltammetry stripping experiments show that TPM-1 is a stronger inhibitor than Janus Green B for copper ion reduction and is essential in creating convection-dependent adsorption behavior. Copper electroplating experiments were conducted, and TPM-1 showed superior microvia-filling performance at a relatively wide concentration range.