High-temperature tensile testing machine for investigation of brittle–ductile transition behavior of single crystal silicon microstructure. (21st April 2015)

• Record Type: Journal Article
• Authors: Uesugi, Akio; Yasutomi, Takahiro; Hirai, Yoshikazu; Tsuchiya, Toshiyuki; Tabata, Osamu
• Is Part Of: Japanese journal of applied physics. Volume 54:Number 6(2015:Jun.)Supplement 1
• Publication Date: 2015-04-21
• Subjects: Physics -- Periodicals; 621.05
• DOI: 10.7567/JJAP.54.06FP04
• Languages: English
• ISSNs: 0021-4922

Abstract

Abstract: This paper reports development of a high-temperature tensile testing machine and testing of single crystal silicon (SCS) for investigation of the size effect on brittle–ductile transition temperature (BDTT). Two different-width 〈110〉 SCS specimens (120 µm long, 5 µm thick and 4 or 9 µm wide) were tested in a vacuum at the temperature range from room temperature to 600 °C. The specimens tested at 500 °C and above exhibit slip, which indicated that the micrometer-sized silicon structures have lower BDTT compared to millimeter-sized ones. By investigating the temperature ranges of the slip occurrences among the differently-sized specimens including other researchers' reports, we found that the length along slip direction, i.e., thickness, might dominate the BDTT.