The Influence of Adsorption Kinetics on Copper Superfilling for Dual Damascene. Issue 6 (25th February 2016)

• Record Type: Journal Article
• Authors: Liske, R.; Krause, R.; Uhlig, B.; Gerlich, L.; Bott, S.; Wislicenus, M.; Preusse, A.
• Is Part Of: Journal of the Electrochemical Society. Volume 163:Issue 6(2016)
• Page Start: D213
• Page End: D220
• Publication Date: 2016-02-25
• Subjects: Accelerator -- Adsorption kinetics -- Co-Adsorption -- Copper deposition -- Dual Damascene -- SEM Cross-Sections -- Superfilling -- Suppressor -- Synergetic interaction; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0261606jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : The proceeding scaling in microelectronic devices requires smaller and smaller copper wires for energy transfer in integrated devices. Voids in the copper wires lead to a resistance increase and damage of the wiring. Copper wires are fabricated by electrochemical deposition as it enables a bottom-up, void free copper growth, so-called superfilling. The present work focuses on the mechanism of the electrochemical deposition with the goal of understanding and describing the superfilling. Electrochemical measurements and partial fill experiments under production-like conditions are carried out to study the effects of bath additives. The co-adsorption theory is adopted to explain additive interaction which is presumed to be the key for superfilling. It is shown that superfilling is a result of the synergetic adsorption behavior of at least two organic additives and a kinetic balancing between additive accumulation and copper deposition rate.