A Low-Cost, Micropattern Transfer Process for Thick-Film Metallization of PDMS. Issue 5 (21st January 2017)

• Record Type: Journal Article
• Authors: Hilbich, D.; Gray, B. L.; Shannon, L.
• Is Part Of: Journal of the Electrochemical Society. Volume 164:Issue 5(2017)
• Page Start: B3067
• Page End: B3076
• Publication Date: 2017-01-21
• Subjects: electrodepostion -- electroplating -- flexible electronics -- MEMS -- micropattern transfer -- polymer metallization -- stretchable electronics; Electrochemistry -- Periodicals; 541.3705
• DOI: 10.1149/2.0111705jes
• Languages: English
• ISSNs: 0013-4651

Abstract

Abstract : We present the detailed characterization of a novel microfabrication process to produce thick-film copper microstructures that are embedded in polydimethylsiloxane (PDMS). This process has reduced fabrication complexity and cost compared to existing metal-on-PDMS techniques and enables rapid prototyping of designs using minimal microfabrication equipment. This technology differs from others in its use of a conductive copper paint seed layer and a unique infrared-assisted transfer process that results in copper microstructures embedded in PDMS. By embedding microstructures flush with the PDMS surface, rather than fabricating the microstructures on the substrate surface, we produce a metallization layer that adheres to PDMS without the need for surface modifications. In addition, the electrodeposition process results in a highly-conductive, thick-film, copper layer. Deposited patterns are shown to be 70-micrometers-thick with reliable feature sizes as small as 100 micrometers. The copper layer has a surface roughness of approximately 5 micrometers and a low film resistivity of approximately 2.5-3 micro-Ω-cm.