Cite
HARVARD Citation
Jayachandran, B. et al. (2021). Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering. Materials research bulletin. p. . [Online].
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Jayachandran, B. et al. (2021). Thermally stable, low resistance Mg2Si0.4Sn0.6/Cu thermoelectric contacts using SS 304 interlayer by one step sintering. Materials research bulletin. p. . [Online].