Correlating Coefficient of Friction and Shear Force to Platen Motor Current in Tungsten and Interlayer Dielectric Chemical Mechanical Planarization at Highly Non-Steady-State Conditions. (16th October 2019)
- Record Type:
- Journal Article
- Title:
- Correlating Coefficient of Friction and Shear Force to Platen Motor Current in Tungsten and Interlayer Dielectric Chemical Mechanical Planarization at Highly Non-Steady-State Conditions. (16th October 2019)
- Main Title:
- Correlating Coefficient of Friction and Shear Force to Platen Motor Current in Tungsten and Interlayer Dielectric Chemical Mechanical Planarization at Highly Non-Steady-State Conditions
- Authors:
- Headley, R.
Frank, C.
Sampurno, Y.
Philipossian, A. - Abstract:
- Abstract : Correlations between shear force and platen motor current (PMC), as well as those between coefficient of friction (COF) and PMC were investigated for various tungsten and interlayer dielectric (ILD) chemical mechanical planarization (CMP) cases where the processes were highly non steady-state. We chose to initially focus on non-steady-state conditions because we believed the relationships among shear force, COF and platen motor current to be clearer as opposed to steady-state conditions. Shear force, normal force and PMC data were collected from twelve different Stribeck+ curves at an acquisition frequency of 1, 000 Hz and analyzed in order to determine any emerging trends. For the 12 cases, involving 8 pre-polished blanket CVD tungsten and 4 silicon dioxide blanket wafers, it was discovered that PMC closely mirrored shear force as evidenced by a high average correlation coefficient (0.955) and coefficient of determination (0.916) obtained from all runs. For COF vs. PMC, the average correlation coefficient and coefficient of determination for all cases were 0.758 and 0.608, respectively. These average values were dragged down by 5 cases in which the dominant tribological mechanism was found to be "boundary lubrication" where COF changed minimally with pseudo-Sommerfeld number.
- Is Part Of:
- ECS journal of solid state science and technology. Volume 8:Number 10(2019)
- Journal:
- ECS journal of solid state science and technology
- Issue:
- Volume 8:Number 10(2019)
- Issue Display:
- Volume 8, Issue 10 (2019)
- Year:
- 2019
- Volume:
- 8
- Issue:
- 10
- Issue Sort Value:
- 2019-0008-0010-0000
- Page Start:
- P634
- Page End:
- P645
- Publication Date:
- 2019-10-16
- Subjects:
- Semiconductors -- Chemical Mechanical Planarization -- Planarization -- Polishing
Solid state chemistry -- Periodicals
Electronics -- Materials -- Periodicals
Electrochemistry -- Periodicals
541.0421 - Journal URLs:
- https://iopscience.iop.org/journal/2162-8777 ↗
http://www.electrochem.org/ ↗ - DOI:
- 10.1149/2.0251910jss ↗
- Languages:
- English
- ISSNs:
- 2162-8777
- Deposit Type:
- Legaldeposit
- View Content:
- Available online (eLD content is only available in our Reading Rooms) ↗
- Physical Locations:
- British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store - Ingest File:
- 15459.xml