Real-Time Shear and Normal Force Trends in Copper Chemical Mechanical Planarization with Different Conditioning Discs. (5th March 2018)

• Record Type: Journal Article
• Authors: Peckler, L.; Han, R.; Sampurno, Y.; Philipossian, A.
• Is Part Of: ECS journal of solid state science and technology. Volume 7:Number 3(2018)
• Page Start: P125
• Page End: P131
• Publication Date: 2018-03-05
• Subjects: Solid state chemistry -- Periodicals; Electronics -- Materials -- Periodicals; Electrochemistry -- Periodicals; 541.0421
• DOI: 10.1149/2.0201803jss
• Languages: English
• ISSNs: 2162-8777

Abstract

Abstract : The effect of two different commercially-available CVD-coated diamond conditioning discs on copper CMP was investigated tribologically and kinetically with the intent of correlating pad surface micro-texture to polish performance. Data analyses were particularly focused on in-situ shear and normal force measurements taken during polishing at several pressures (P) and sliding velocities (V), including Fast Fourier Transform (FFT) analysis of the data. One of the two discs consistently resulted in greater variances of shear force with increasing P and V indicative of increased pad-slurry-wafer stick-slip events. This trend correlated to higher values of coefficient of friction (COF) and removal rate (RR). By dividing the shear force variance by the normal force variance, a new parameter, termed directivity, was used to further emphasize the improved performance of the above-mentioned disc. Lastly, the tribological and kinetic data, combined with data regarding the pad's micro-texture and its extent of contact with the wafer, showed that at all values of P and V, higher values of directivity correlated to more contacting pad asperities, a greater asperity density and a thinner micro hydrodynamic lubrication layer, thus highlighting the potential importance of directivity in future studies.