Preparation and Properties of Novel Cross‐Linked Fluorinated Poly(aryl ether) with Low Dielectric Constant and High Thermal Stability. Issue 24 (27th May 2020)

• Record Type: Journal Article
• Authors: Wang, Zhaoyang; Xie, Yunrui; Shang, Yingshuang; Xu, Da; Jiang, Zilong; Xu, Qinfei; Zhou, Chenyi; Zhang, Haibo
• Is Part Of: Macromolecular rapid communications. Volume 41:Issue 24(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-05-27
• Subjects: cross‐linked structures -- energy storage -- fluorinated poly(aryl ether) -- microelectronics; Macromolecules -- Periodicals; Polymers -- Periodicals; Chemistry -- Periodicals; 547.705
• DOI: 10.1002/marc.202000100
• Languages: English
• ISSNs: 1022-1336

Abstract

Abstract: Fluorinated poly(aryl ether)s (FPAEs) have attracted much attention due to their high thermal stability, excellent mechanical strength, and low dielectric constant. High‐molecular‐weight fluorinated poly(aryl ether) containing phenylethynyl (FPAE‐PE) is successfully synthesized by nucleophilic substitution between 3‐ethynylphenol and FPAE. The cross‐linked fluorinated poly(aryl ether) (C‐FPAE‐PE) is prepared by thermal treatment of FPAE‐PE at 300 °C. The thermal stability, dynamic thermomechanical property, and dielectric performance of C‐FPAE‐PE are systematically studied. C‐FPAE‐PE has excellent heat resistance with 5% weight loss temperature ( T d5% ) at 490 °C in air and high thermomechanical properties with storage modulus retention of 50% at 215 °C. C‐FPAE‐PE displays low and steady dielectric constant of 2.4 and dielectric loss of 0.004 at 215 °C, exhibiting potential applications in the field of microelectronics, communication technology, and energy storage as high‐temperature low dielectric materials. Abstract : Cross‐linked fluorinated poly(aryl ether) (C‐FPAE‐PE) is prepared by a thermal cross‐linking reaction. C‐FPAE‐PE has a high storage modulus and excellent dynamic thermomechanical property in a wider operating temperature range. C‐FPAE‐PE can maintain a low dielectric constant and low dielectric loss at high temperature. The preparation strategy is universal and the prepared C‐FPAE‐PE has important practical value in microelectronics and energy storage.