Development and characterization of fully bio‐based polybenzoxazine‐silica hybrid composites for low‐k and flame‐retardant applications. (10th April 2019)

• Record Type: Journal Article
• Authors: Krishnamoorthy, Krishnadevi; Subramani, Devaraju; Eeda, Naveena; Muthukaruppan, Alagar
• Is Part Of: Polymers for advanced technologies. Volume 30:Number 7(2019)
• Page Start: 1856
• Page End: 1864
• Publication Date: 2019-04-10
• Subjects: bio‐polybenzoxazine -- bio‐silica -- flame‐retardant -- low‐k -- thiol functionalization; Polymers -- Periodicals; 668.9
• DOI: 10.1002/pat.4618
• Languages: English
• ISSNs: 1042-7147

Abstract

Abstract : In the present work, new classes of bio‐based polybenzoxazines were synthesized using eugenol as phenol source and furfurylamine and stearylamine as amine sources separately through solventless green synthetic process routes and were further reinforced with varying percentages (1, 3, 5, and 10 wt%) of silica (from rice husk) to attain hybrid composites. The molecular structure, cure behaviour, thermal stability, dielectric properties, and flame‐retardant behaviour of both benzoxazine monomers and benzoxazine composites were characterized using appropriate modern analytical techniques. The eugenol‐based benzoxazines synthesized using furfurylamine (FBz) and stearylamine (SBz) were cured at 223°C and 233°C, respectively. The differential scanning calorimetry (DSC) data reveal the glass transition temperatures ( T g ) of FBz and SBz were 157°C and 132°C, respectively, and the maximum decomposition temperature ( T max ) as obtained from thermogravimetric analysis (TGA), were found to be 464°C and 398°C for FBz and SBz, respectively. The dielectric constants for FBz and SBz obtained at 1 MHz were 3.28 and 3.62, respectively. Furthermore, varying weight percentages (1, 3, 5, and 10 wt%) of 3‐mercaptopropyltrimethoxysilane (3‐MPTMS) functionalized bio‐silica reinforced the composite materials as evidenced by their improved thermal stability and lower dielectric constant. Data obtained from thermal and dielectric studies suggested that these polybenzoxazines could be used in the form of adhesives, sealants, and composites for high performance inter‐layer low‐k dielectric applications in microelectronics.