Mechanisms of adhesion degradation at the photovoltiac module's cell metallization‐encapsulant interface. (15th January 2019)

• Record Type: Journal Article
• Authors: Bosco, Nick; Moffitt, Stephanie; Schelhas, Laura T.
• Is Part Of: Progress in photovoltaics. Volume 27:Number 4(2019)
• Page Start: 340
• Page End: 345
• Publication Date: 2019-01-15
• Subjects: degradation -- encapsulation -- metallization -- photovoltaic module -- reliability -- screen printing; Solar cells -- Periodicals; Photovoltaic cells -- Periodicals; Solar power plants -- Periodicals; 621.31245
• DOI: 10.1002/pip.3106
• Languages: English
• ISSNs: 1062-7995

Abstract

Abstract: Adhesion measurements and chemical characterization of the encapsulant/silver metallization interface of a photovoltaic (PV) module through temperature, humidity, and voltage bias exposures were conducted. Results demonstrate two independent degradation mechanisms: (a) with voltage bias, the ionic conduction of Na + ions through the encapsulant results in the formation of sodium silicate at the silver metallization surface, thereby weakening that interface and (b) with moisture ingress, dissociation of the silane bonding to silver in the silver oxide similarly weakens this interface resulting in significantly lower debond energies. Abstract :