Switchable Underwater Adhesion by Deformable Cupped Microstructures. Issue 23 (5th October 2020)

• Record Type: Journal Article
• Authors: Wang, Yue; Kang, Victor; Federle, Walter; Arzt, Eduard; Hensel, René
• Is Part Of: Advanced materials interfaces. Volume 7:Issue 23(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-10-05
• Subjects: cupped microstructures -- pick‐and‐place -- switchable adhesion -- two‐photon lithography -- underwater adhesion; Materials science -- Periodicals; 620.11
• DOI: 10.1002/admi.202001269
• Languages: English
• ISSNs: 2196-7350

Abstract

Abstract: Switchable underwater adhesion can be useful for numerous applications, but is extremely challenging due to the presence of water at the contact interface. Here, deformable cupped microstructures (diameter typically 100 µm, rim thickness 5 µm) are reported that can switch between high (≈1 MPa) and low (<0.2 MPa) adhesion strength by adjusting the retraction velocity from 100 to 0.1 µm s –1 . The velocity at which the switch occurs is determined by specific design parameters of the cupped microstructure, such as the cup width and angle. The results are compared with theoretical estimates of water penetration into the contact zone and expansion of the cup during retraction. This work paves the way for controlling wet adhesion on demand and may inspire further applications in smart adhesives. Abstract : Deformable cupped microstructures can be switched between high and low adhesion strength underwater by varying the retraction velocity from 100 to 0.1 µm s –1 . The velocity at which the switch occurs is determined by specific design parameters of the cupped microstructure, such as the cup width and angle.