Carborane-containing bismaleimide resins with excellent heat resistance and dimensional stability. (March 2021)

• Record Type: Journal Article
• Authors: Wu, Yuane; Chen, Gong; Gao, Longfei; Zhang, Wei; Li, Song
• Is Part Of: High performance polymers. Volume 33:Number 2(2021)
• Page Start: 176
• Page End: 183
• Publication Date: 2021-03
• Subjects: Carborane-containing bismaleimide -- cure behavior -- thermal property -- coefficient of thermal expansion; Polymerization -- Periodicals; Polymers -- Periodicals; 547.7
• DOI: 10.1177/0954008320948939
• Languages: English
• ISSNs: 0954-0083

Abstract

Novel carborane-containing bismaleimides with excellent heat resistance and dimensional stability for advanced composites are presented. First, a new kind of carborane-containing mono-maleimido-terminated monomer 1-(4-tolyl)-2-(4-maleimido phenyl)- o -carborane (CB-MI) was synthesized and characterized by FT-IR and 1 H-NMR. Then, it was used as a modifier for bismaleimide resin 4, 4'-bismaleimidodiphenylmethane (BDM) with different weight fraction of CB-MI. The curing behavior and thermal property of the CB-MI/BDM resin systems were studied and presented here. Results displayed that a wide processing window and low curing temperature provided a good processability for the CB-MI/BDM resin system. Due to the effect of carborane groups, the char yield at 600°C of the cured resin systems tended to be increased with the addition of CB-MI. Moreover, the coefficient of thermal expansion of the resin was found to be reduced with the increase of CB-MI, indicative of a remarkable dimensional stability. This study might open up great opportunities for the preparation and design of various novel bismaleimides in a simple and feasible way and the resins with good thermal property and processability at the same time.