Air-Cooled Thermosyphon for Press-Pack Stack of Semiconductors. Issue 3 (September 2016)

• Record Type: Journal Article
• Authors: Habert, M.; Agostini, B.
• Is Part Of: Journal of physics. Volume 745:Issue 3(2016)
• Publication Date: 2016-09
• Subjects: Physics -- Congresses; 530.5
• DOI: 10.1088/1742-6596/745/3/032110
• Languages: English
• ISSNs: 1742-6588

Abstract

Abstract: Medium voltage converters make extensive use of press-pack semiconductors in several products ranging from drives to rectifiers. Better cooling brings significant advantages: the possibility of drawing more power using the same semiconductors and thus effectively extending the converter operating range, a higher reliability, and cost savings on semiconductors for equal converter power. In this article, the experimental characterization of a baseplate to air thermosyphon for the double-side cooling of press pack thyristor modules in presented. Effects of refrigerant fluid filling, heat load, air temperature and air flow on the junction temperature were studied in both vertical and horizontal stack configuration. Vertical evaporator yields the best performance with 120°C junction temperature at 40°C air and 30W/cm 2 heat loss.