Numerical Simulation and Structural Optimization of Multi‐Stage Planar Thermoelectric Coolers. Issue 22 (28th September 2020)

• Record Type: Journal Article
• Authors: Nie, Xiaolei; Jiang, Haolan; Sang, Xiahan; Wei, Ping; Zhu, Wanting; Zhao, Wenyu; Zhang, Qingjie
• Is Part Of: Physica status solidi. Volume 217:Issue 22(2020)
• Page Start: n/a
• Page End: n/a
• Publication Date: 2020-09-28
• Subjects: finite-element methods -- large-area hot sources -- multi-stage planar thermoelectric coolers -- numerical simulation -- structural optimization; Solid state physics -- Periodicals; Solids -- Industrial applications -- Periodicals; 530.41
• DOI: 10.1002/pssa.202000248
• Languages: English
• ISSNs: 1862-6300

Abstract

Abstract : How to efficiently dissipate the heat of a large‐area hot source is an urgent problem to be solved in the thermal management field of electronic devices. Herein, multi‐stage planar thermoelectric coolers (TECs) oriented to the efficient planar heat dissipation for large‐area hot source are designed, and a comprehensive numerical analysis focusing on the cooling performance of the coolers for a heat source is performed by the finite‐element methods. The effect of input current, thickness of thermoelectric legs, stage numbers in heat transfer area, numbers of p – n pair in each stage, heat resistance between each stage, and contact status between heat sources and coolers are studied. The results show that high cooling performance of the coolers relies on an optimized input current, large thickness of thermoelectric legs, optimized stage number and number of p – n pair, and low heat resistance between each stage and between heat sources and coolers. The optimized multi‐stage planar TEC can realize a maximum cooling temperature difference of 8.2 K. This work indicates that the multi‐stage planar TECs can have potential application in thermal management of electronic devices. Abstract : Multi‐stage planar thermoelectric coolers (TECs), which can have potential application in thermal management of electronic devices, are developed. Through optimizing input current, thickness of thermoelectric legs, stage number, p – n pair number, heat resistance between each stage, and contact status between heat sources and coolers, the maximum cooling temperature difference of the multi‐stage planar TEC can reach 8.2 K.