Influence of Ni addition on the mechanical properties of Bi-5Sb-8Sn solder alloys. (May 2015)

• Record Type: Journal Article
• Authors: Wang, W. L.; Yan, Y. F.
• Is Part Of: Materials research innovations. Volume 19(2015)Supplement 5
• Page Start: S5-1102
• Page End: S5-1106
• Publication Date: 2015-05
• Subjects: Bi-based solder alloy -- Mechanical property -- Microstructure -- Ni addition -- Tensile strength -- Shear strength; Materials -- Research -- Periodicals; Matériaux -- Recherche -- Périodiques; 620.1105
• DOI: 10.1179/1432891714Z.0000000001256
• Languages: English
• ISSNs: 1432-8917

Abstract

Abstract : In this paper, the microstructures of solder alloys were improved by adding trace elements of Ni to BiSbSn solder to enhance Bi-based solder alloys mechanical properties. The spreading areas, tensile strengths and shear strengths of the Bi-5Sb-8Sn-xNi solders with various Ni contents were characterised. The results revealed that after Ni was added to the BiSbSn solder, two new phases occurred: Ni3 Sn4 and NiSb2 . When the Ni content was 1%, the solder tensile strength was at the highest. When the Ni content was less than 3%, the shear strength increased as the Ni content increased. When the Ni content was more than 3%, the shear strength decreased gradually, primarily owing to the large amounts of impurities and pores introduced by the internal aggregation effect. In summary, when the Ni content was between 1 and 3%, the solders had the most-usable overall properties.