Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system. (21st October 2020)

• Record Type: Journal Article
• Authors: Lin, Yingfei; Hao, Yangyang; Lu, Jianning; Liu, Tianlong
• Is Part Of: Materials research express. Volume 7:Number 10(2020)
• Publication Date: 2020-10-21
• Subjects: coating materials -- AlN/(Ti -- W)/Cu substrates -- microstructure -- adhesion strength -- heat conduction; Materials science -- Research -- Periodicals; Materials science -- Periodicals; 620.11
• DOI: 10.1088/2053-1591/abc0a3
• Languages: English
• ISSNs: 2053-1591

Abstract

Abstract: AlN/(Ti, W)/Cu substrates were successfully fabricated by the combination of magnetron sputtering and electroless copper plating, exhibited layered distribution without obvious defects or delamination. The adhesion film in AlN/Ti/Cu was composed of TiN, Al, and Ti crystallites due to the reaction between the sputtered Ti layer and the AlN substrate, while in AlN/W/Cu was α -W and β -W crystallites with a mixed distribution but a thin W-rich amorphous layer at the interface towards Cu contact. In AlN/TiW/Cu was W-rich Tix W1−x and α -Ti with the interlayer distribution. The scratch failure of the AlN/(Ti, W)/Cu substrates included the peeling of the Cu plating layer and adhesion film. The nanoscale hard phase layered combination of the adhesion film in AlN/TiW/Cu exhibited better peeling resistance, resulting in the most prominent adhesion strength among the substrate system. The existence of an amorphous layer in AlN/W/Cu led to the lower thermal conductivity. AlN/TiW/Cu substrate showed good comprehensive properties including adhesion strength and thermal conductivity.