High thermal conductivity of epoxy composites via micro-zone enhanced 3D interconnected nickel skeleton. Issue 17 (1st December 2020)

• Record Type: Journal Article
• Authors: Bao, Di; Cui, Yexiang; Xu, Fei; Li, Meiling; Li, Kaka; Zhang, Xiguang; Liu, Zhanjian; Zhu, Yanji; Wang, Huaiyuan
• Is Part Of: Ceramics international. Volume 46:Issue 17(2020)
• Page Start: 27531
• Page End: 27538
• Publication Date: 2020-12-01
• Subjects: Micro-zone enhancement -- Thermal conductivity -- Boron nitride -- Nickel foam -- Epoxy composite; Ceramics -- Periodicals; Céramique industrielle -- Périodiques; Ceramics; Periodicals; Electronic journals; 666
• DOI: 10.1016/j.ceramint.2020.07.245
• Languages: English
• ISSNs: 0272-8842

Abstract

Abstract: The composites with high thermal conductivity (TC) have attracted extensive attention in thermal management fields. Incorporating a three dimensional (3D) thermal transport framework in polymer is one of the most effective ways to improve the TC of composites. However, most micro-zone of those 3D thermal transport framework is filled with polymers with very low TC, leading to limited TC improvement of polymer composites. Herein we presented a novel 3D boron nitride (BN)/nickel foam (NF)/epoxy (EP) composite with high TC. Results indicated that as a good reinforced filler with high TC, BN was homogeneously dispersed in epoxy and fully filled into 3D NF micro-zone to get obvious TC increase of the BN/NF/EP composites. With the micro-zone enhancement strategy, the prepared BN/NF/EP-50 composite demonstrated excellent thermal conductive property. The obtained TC (5.14 W m −1 K −1 ) is approximately 24 and 5 times higher than that of epoxy and NF/EP composite, respectively. This research potentially provides a unique way to design and fabricate high TC 3D materials with the micro-zone enhancement strategy.