Multiphysics coupling model for the crack repairing process using electrochemical deposition. (20th December 2020)

• Record Type: Journal Article
• Authors: Zhou, Yueting; Liu, Wei; Chen, Qing; Li, Haoxin; Zhu, Hehua; Ju, Jiannwen
• Is Part Of: Construction & building materials. Volume 264(2021)
• Publication Date: 2020-12-20
• Subjects: Crack repairing -- Multiphysics coupling model -- Electrochemical reaction; Building materials -- Periodicals; 624.18
• DOI: 10.1016/j.conbuildmat.2020.120625
• Languages: English
• ISSNs: 0950-0618

Abstract

Highlights: A multiphysics coupling model is proposed to analyze the transient deposition products on metal surfaces. The proposed model can effectively describe the growth of filling depth. The linear growth mechanism of filling depth is revealed. The propagating nitrate ionic enrichment zone spreads as t . Abstract: A multiphysics coupling model is proposed to analyze the transient deposition products on metal surfaces by considering mass transfer, electrochemical reactions, and precipitation reactions. We employ a level set method to capture the growing interface of corrosion product deposition. Comparing the simulations with experimental results shows that the proposed model can effectively describe the growth of filling depth. Under the early stages, we reveal the linear growth mechanism of the filling depth, which mainly contributes to the hydroxide concentration. Besides, the propagating nitrate ionic enrichment zone spreads as t . Detailed finite element simulations in conjunction with existing experimental data corroborate these relations. Furthermore, detailed studies are performed to elucidate the crack repairing. The factors affecting the crack repairing are investigated, including the applied voltage, deposition rate prediction constant, and electrolyte concentration. The presented results provide some important guidance and physical insights into the optimization for crack repairing process applications by electrochemical deposition.