Cite
HARVARD Citation
Dornic, N. et al. (2020). Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling. Microelectronics and reliability. p. . [Online].
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Dornic, N. et al. (2020). Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling. Microelectronics and reliability. p. . [Online].