Cite
HARVARD Citation
Ben Romdhane, E. et al. (2020). Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components. Microelectronics and reliability. p. . [Online].
This is an interim version of our Electronic Legal Deposit Catalogue-eJournals and eBooks while we continue to recover from a cyber-attack.
Ben Romdhane, E. et al. (2020). Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components. Microelectronics and reliability. p. . [Online].