Nano-deformation behavior of silicon (100) film studied by depth sensing indentation and nanoscratch technique. (11th April 2018)

• Record Type: Journal Article
• Authors: Geetha, D; Pratyank, R; Kiran, P
• Is Part Of: Materials research express. Volume 5:Number 4(2018)
• Publication Date: 2018-04-11
• Subjects: Si (100) -- nanoindentation -- deformation -- nanoscratch -- scanning probe microscopy; Materials science -- Research -- Periodicals; Materials science -- Periodicals; 620.11
• DOI: 10.1088/2053-1591/aab910
• Languages: English
• ISSNs: 2053-1591

Abstract

Abstract: Silicon being the most important material applied in microelectronic and photovoltaic technology, repeated investigation of the mechanical properties becomes essential. The nanoscale elastic-plastic deformation characteristics of Si (100) film were analyzed using nanoindentation and nanoscratch techniques. The hardness and elastic modulus values of the film obtained from nanoindentation tests were found to be consistent with the reported values. The load-displacement curves showed discontinuities and kinks which confirms the plastic behaviour of Si. The indentation induced plastic deformations were the consequences of the phase transformations. The critical shear stress, tensile strength and plastic zone size, of the Si film when subjected to nanoindentation were determined. The nanoscratch tests were performed to understand the tribological properties of the film. The SPM images of both the nanoindentation and nanoscratch profiles were useful in revealing the plastic character in terms of the piling up of matter in the vicinity of the dents. Conclusions were drawn in quantifying the plastic deformations and phase transformations.