Biocorrosion of copper metal by Aspergillus niger. (October 2020)

• Record Type: Journal Article
• Authors: Zhao, Jiayue; Csetenyi, Laszlo; Gadd, Geoffrey Michael
• Is Part Of: International biodeterioration & biodegradation. Volume 154(2020)
• Publication Date: 2020-10
• Subjects: Aspergillus niger -- Copper -- Biocorrosion -- Oxalate -- Biomineralization; Biodegradation -- Periodicals; Bioremediation -- Periodicals; Biodegradation -- Periodicals; Biodégradation -- Périodiques; Biorestauration -- Périodiques; Electronic journals; 620.11223
• DOI: 10.1016/j.ibiod.2020.105081
• Languages: English
• ISSNs: 0964-8305

Abstract

Abstract: Several geoactive fungi were investigated for their biocorrosion impact on metallic copper, to further understanding of the potential roles that fungi may have in the biotransformation of such substrate, and the mechanisms involved. Copper metal showed little toxicity and test fungi were able to grow in direct or indirect contact with copper and to colonize copper sheet. A. niger was able to biodeteriorate copper metal through proton- and ligand-mediated dissolution mechanisms, leading to significant mass loss and surface etching. The formation of a secondary copper oxalate (moolooite) biomineral crust together with cuprite deposition lead to alteration of surface topography and visual appearance, highlighting the significance of oxalate excretion in effecting fungal metal biotransformations. The metal transforming influence of fungal colonization may have some implications for biodeterioration, protection and preservation of cultural relics and artefacts as well as certain components of the built environment. Graphical abstract: Image 1 Highlights: Geoactive fungi were able to colonize and biodeteriorate copper metal. Main biodeterioration mechanisms were mediated by protons and oxalic acid. Fungal activity led to loss of mass as well as etching patterns of colonization. A copper oxalate and cuprite crust formed on the surface of copper metal.