IR sensor array using photo-patternable temperature sensitive paint for thermal imaging. (24th September 2015)

• Record Type: Journal Article
• Authors: Tsukamoto, T; Wang, M; Tanaka, S
• Is Part Of: Journal of micromechanics and microengineering. Volume 25:Number 10(2015:Oct.)
• Publication Date: 2015-09-24
• Subjects: temperature sensitive paint -- infrared thermal imaging -- Eu(TTA)3; Microelectromechanical systems -- Periodicals; Micromechanics -- Periodicals; 621.38105
• DOI: 10.1088/0960-1317/25/10/104011
• Languages: English
• ISSNs: 0960-1317

Abstract

Abstract: This paper reports an infrared-to-visible transducer array made of temperature sensitive paint (TSP) for a low-cost thermal imaging application. A novel fabrication process using a photo-patternable temperature sensitive paint (PTSP) combined with an SU-8 transfer method was developed. A PTSP microstructure as small as 2 μ m was successfully patterned by the normal photolithography process, and sensitivity as high as −0.5%/°C was obtained. The proposed method simplifies the fabrication process, and prevents the TSP from plasma-induced damage. A self-suspended structure as small as 70 μm was successfully fabricated with a large-gap of 40 μ m from the substrate. The heated object at 250 °C was detectable with a spatial resolution of about 380 μ m.